PCB (Printed Circuit Board) hi MINI LED backplanes tan chuan hun rei tak chhung chu duhthlan tur hmasa ber a ni tawh a. Mahse Mini LED chip te chu a te deuh deuh a, a te deuh deuh chuan glass chuan PCB a thlak zauh zauh a.
Tun hnaiah Boe chuan MINI LED hmasawnna thar chu investor interactive platform-ah a pholang a. Boe chuan company chuan mini led products awm theihna tur a beisei thu a sawi a, glass-based Mini LED related products a deploy tawh thu a sawi bawk. Company glass-based MINI LED hi kumin kum chanve hnu lamah chuan mass-a siam chhuah theih beisei a ni. TCL Technology (000100) chuan "China Electronics News" atanga reporter pakhat interview-ah glass base hian a siam chhuah man nasa takin a tihhniam dawn tih a sawi a, tunah hian a mini LED backlight products te hian he thil hi an hmang mek a ni.
PCB thlak hi thil awlsam a ni lo. Kum hnih kalta chhung khan MINI LED backlight technology hi a lar chho zel a, company tam tak deploy tur a hip lut a, kuminah pawh MINI LED backlight products mass production an neih theih tur thu an sawi chiang hle. Chuancai Securities chuan kumin April thlaa report an siamah kum 2020 chu "mini led backlight + LCD" products tam tak siam chhuah kum khatna a nih thu a tarlang a, tunah chuan MINI LED technology hman dan chu a hlawkthlak hle tih a tarlang.
Ngaihven hlawh tak a nih laiin, Mini LED backlight hian technical route hrang hrang game leh update a tawng tawh bawk. Chumi zingah chuan mini LED backlight-substrate siam chhuahna material pawimawh tak chu harsatna a tawk mek a ni. LED packaging siamtute hian PCB an tipung ber a, panel siamtute chuan glass substrate solution an support bawk. Hriat tur chu tun hma chuan Mini LED backlight products substrate material hi PCB a ni fo thin.
LED packaging siamtu pakhat chuan China Electronics atanga reporter pakhat interview a neihnaah Mini LED backplane material hman hmasak ber chu PCB hman hmasak ber a nih chhan ber chu LED packaging factory hi mini LED siam leh siam hmasa ber a nih vang a ni, a ti. Hemi kawngah hian a inrawlh a ni. LED packaging factory hian PCB substrate technical solutions a thiam zawk a, industrialization pawh rang zawkin a rawn luh tir thei bawk. Chutih rual chuan PCB substrate technology a puitlin zawk a, supply chain pawh a kim vek avangin PCB-based MINI LED products yield rate chu he stage-a Glass-based Mini LED products aiin a sang zawk hle.
Ruifeng Optoelectronics (300241) enkawltu relevant person te pawhin reporter te hnenah glass substrate-ah hian technical bottleneck thenkhat hneh loh an la awm a, PCB substrate solution pawh rang taka inrawlh theih a nih thu a sawi bawk a, chuvangin PCB-based Mini LED products te chu an thawn thuai dawn a ni. Glass substrate solution technological leadership neih hi Mini LED backlight tan chuan thil awlsam a ni lo niin a lang. Mahse, industry-a mite chuan Glass hian PCB a thlak zauh zauh dawn a, MINI LED backlight backplane-te tan duhthlan tur hmasa ber a ni dawn tih an la ring reng a ni.
PCB hi a performance avang hian a tlem hle. Tunah chuan MINI LED market hi LED packaging siamtute mithmuhah chuan thau chi khat chauh ni lovin, panel siamtute tan pawh indona hmun a ni. Panel siamtute chuan MINI LED market-a an luh hnuah, glass substrate thar hmanga an hman chhan chu LED siamtute’n PCB an thlan chhan nen a inang hle. "Glass substrate hi LCD panel siamna atana hmanraw pawimawh ber a ni fo thin. Panel siamtute tan chuan BOE leh TCL huaxing te tan chuan glass substrate hi 'quick start' atan mini LED backlight atan thlan a ni. CCID Consulting-a senior analyst Liu Tun chuan a sawi.
Adaptability factors bakah hian substrate material thlan dan tur dik tak chu cost leh performance a ni. Industry chhunga mi te chuan glass-based Mini LED te hian man tlawm zawk leh performance tha zawk an nei niin an ngai. Display effect tihchangtlunna hian Mini LED backlight performance-ah requirement sang zawk a dah mai bakah, backplane-a thickness uniformity, flatness, leh alignment processing accuracy-ah harsatna thar a siam bawk.
"Tunlai hian Mini LED chip te hi a te chho zel a. Mini LED te hian unit area khatah chip soldering an nei tam zawk dawn a, tuna LED backlight products te aiin heat intensity a sang zawk dawn a ni. PCB substrate te hi anmahni heat dissipation vangin an tlem hle. , warpage leh deformation lama harsatna a awm a, chuvangin PCB substrate-a mini LED chip direct-a transfer chu a harsa zual hle a ni. Liu Tun chuan glass materials te hian heat dissipation tha tak leh thermal expansion rate hniam tak an nei tih an zirchiang a, chu chu high-density mini led welding ah te effective takin hman theih a ni a, complex wiring mamawh te pawh a phuhruk thei bawk. Hei hian MINI LED hrang hrang tan display partition hrang hrangte dynamic dimming a pe a, display effect pawh a ti tha zawk bawk. Tin, glass substrate hian flatness sang tak leh rigidity tha tak a nei bawk. Backlight unit set tam tak spliced a nih chuan glass substrate chuan high-precision splicing mamawh a phuhruk thei a, splicing avanga black seams awm chu a ti tlem thei a, chutiang chuan large-size mini LED products siamchhuahna chu a takin a hriat theih ang.
"Glass substrate hi PCB substrate aiin flatness leh stability lamah a tha zawk mai bakah cost lamah pawh advantage a nei bawk." LED packaging siamtu pakhat chuan tuna domestic PCB substrate stability leh accuracy-a gap awm mek avang hian MINI LEDs mamawh a phuhruk thei lo tih a sawi. PCB substrate-te performance requirement, MINI LED-te’n PCB substrate an mamawh chu Japan, South Korea leh ram leh bial dang aṭanga lakluh a ngai a, a man pawh a to hle. "A bik takin kumin March leh April thla khan ram dang atanga lakluh PCB substrate man a sang hle a ni." Packaging siamtu enkawltu a kaihhnawih chuan a sawi.
BOE Display leh Sensor Business Group Organization-a Technical Planning Department deputy director Qiu Yun chuan, entirnan, 6-layer 2-layer leh 8{9}}layer 3-layer PCB substrate te chu MINI LED backlight atana mamawh chu a bul berah chuan domestic batch-ah a awm lo a, man to takah chauh a la lut thei tih a sawi. TCL enkawltu mi kaihhnawih chuan "China Electronics News" atanga reporter pakhatin kum tam tak chhung a kalpui hnuah tunah chuan glass substrate chu hmanrua leh technology lamah a puitling tawh hle a, glass material supply pawh a nghet hle a, a man pawh a hniam hle tih a tarlang. Chuvangin, LED backplane atan PCB aiah glass hman hian thil siam chhuah man nasa takin a tihtlem mai bakah siamtute rinna a ti nghet thei bawk. TCL enkawltu mi kaihhnawih sawi dan chuan, tuna OEM-te’n an promote mek PCB-based MINI LEDs nen khaikhin chuan, display effect a inang chuan glass-based TFT drive cost a hniam zawk a ni.
Glass substrate hi market-in a la test lo. Ni engemaw zat kalta khan Boe chuan MINI LED hmasawnna thar chu investor interactive platform-ah a rawn pholang a. Boe chuan company chuan MINI LED products awm theihna tur a beisei thu a sawi a, Glass-based Mini LED related products a deploy tawh thu a sawi bawk. Company glass-based Mini LED hi kumin kum chanve hnu lamah chuan mass-a siam chhuah theih beisei a ni. TCL chuan TCL huaxing hian kum 2018 khan glass-based MINI LEDs a deploy tan a, tunah chuan he technology hi a puitling tawh hle tih an sawi. Nakin lawkah chuan MINI LED backlight products hi TV, tablet, laptop leh market dang tam takah hman a nih dawn leh dawn loh chu TCL huaxing hian glass substrate a thlang ngei ang.
Panel siamtute, BOE leh TCL huaxing-te’n Glass Substrate Mini LED backlight an din chu nakin lawka market-a mainstream direction atana an din a nih chuan, packaging siamtu lian tak takte chu National Star Optoelectronics (002449), Ruifeng Optoelectronics (300303), Jingtai Optoelectronics, etc. te pawh an ni. Wang Sen, General Manager of National Star Optoelectronics (600184) Co., Ltd., a sawi dan chuan a glass{7}}a siam MINI LED backlight nena inzawm thil siamte chu batch tlemtea thawn chhuah a ni a, nakin lawka thil thleng tur chu market lian ber a ni ang. Ruifeng Optoelectronics chuan "Investor Relations Activity Record" hnuhnung berah pawh company-in MINI led research project-ah glass substrate leh PCB substrate pahnih a huam tih a sawi bawk.
Mahse, trendforce analyst Chen Shuxun chuan China Electronics News aṭanga reporter pakhatin PCB substrate leh glass substrate-te pawhin an ṭhatna leh ṭhat lohna an neih thu a sawi. Glass substrate-te ṭhatna chu langsar tak ni mah se, an chhiatna, fragility ang chi pawh a lang chiang hle. Eng ang substrate nge kan nih theih ang tih chu kan nghak ang u, nakin lawkah chuan MINI LED backlight trend lian ber a ni thei ang.
