Full lamination, non-AIR-GAP technology tia hriat bawk hian full-surface fit image atanga image danglamna chu screen atanga reflected a ni. Hei hi high-End SMT chip processing smart phone leh tablet panel-a hmasawnna kalphung bulpui ber a ni. Touch panel a process leh components te hi a awlsam ang reng hle a, mahse a nihna takah chuan touch panel process hi a danglam hle. Technology lamah chuan front-end process leh back-end process te hi a danglam nasa hle a, a thang lian zel bawk.
All-round bonding technology chu panel chu outer glass (or touch panel)-ah direct-a glue hmanga glue a, glue hmanga glue a ni. A laiah chuan vacuum state-ah a awm avangin light refraction problem hi pumpelh theih a ni a, mahse, traditional lip glue chu a inzawm a nih chuan glass pahnih ang maia overlapping phenomenon hmuh a awlsam hle. Chu bakah, full-surface fit hian screen a sang zawk-brightness leh high-fidelity realism, outdoor glare hnuaiah pawh SMT processing mobile phone emaw tablets processing screen display content chiang takin i la hmu thei bawk.
Full-surface fit hi trend tha lo tak a ni ang a, mahse tuna challenge awm mek chu touch panel glass capacitor fit aiin fit a harsa zawk a, a size a lian chuan a fit harsa zawk bawk. LCD panel leh touch panel pahnih man hi a tlawm lo. Bonding process chhunga chhiatna a thlen chuan hlohna chu a tam hle ang.
